韩国免费成人在线_日韩黄片一级_亚洲伦理一区_国产一级特黄片_小说区v天堂网_国产av巨作饥渴难耐的男雇主_caoporm超免费公开视频_欧美日韩在线成人_无码av最新清无码专区吞精_在线无码永久免费网址

logo

中文   |  English

 
新聞資訊
聯(lián)系方式
地址:浙江省麗水市蓮都區(qū)南明山街道七百秧街129號
電話:+86-578-3012571
         +86-578-3011857
         +86-578-3615078
傳真:+86-578-3611180
郵件:smrshiling01@163.com
當(dāng)前位置:首頁 > 

半導(dǎo)體術(shù)語中英文對照表,芯片人必備!

時間:2019-6-24   點擊次數(shù):18161

  • 半導(dǎo)體產(chǎn)業(yè)作為一個起源于國外的技術(shù),很多相關(guān)的技術(shù)術(shù)語都是用英文表述。且由于很多從業(yè)者都有海外經(jīng)歷,或者他們習(xí)慣于用英文表述相關(guān)的工藝和技術(shù)節(jié)點,那就導(dǎo)致很多的英文術(shù)語被翻譯為中文之后,很多人不能對照得上,或者不知道怎么翻譯。在這里我們整理一些常用的半導(dǎo)體術(shù)語的中英文版本,希望對大家有所幫助。如果當(dāng)中有出錯,請幫忙糾正,謝謝!


    常用半導(dǎo)體中英對照表


    離子注入機  ion implanter


    LSS理論  Lindhand Scharff and Schiott theory,又稱“林漢德-斯卡夫-斯高特理論”。


    溝道效應(yīng)  channeling effect


    射程分布  range distribution


    深度分布  depth distribution


    投影射程  projected range


    阻止距離  stopping distance


    阻止本領(lǐng)  stopping power


    標(biāo)準(zhǔn)阻止截面  standard stopping cross section


    退火  annealing


    激活能  activation energy


    等溫退火  isothermal annealing


    激光退火  laser annealing


    應(yīng)力感生缺陷  stress-induced defect


    擇優(yōu)取向  preferred orientation


    制版工藝  mask-making technology


    圖形畸變  pattern distortion


    初縮  first minification


    精縮  final minification


    母版  master mask


    鉻版  chromium plate


    干版  dry plate


    乳膠版  emulsion plate


    透明版  see-through plate


    高分辨率版  high resolution plate, HRP


    超微粒干版  plate for ultra-microminiaturization


    掩模  mask


    掩模對準(zhǔn)  mask alignment


    對準(zhǔn)精度  alignment precision


    光刻膠  photoresist,又稱“光致抗蝕劑”。


    負(fù)性光刻膠  negative photoresist


    正性光刻膠  positive photoresist


    無機光刻膠  inorganic resist


    多層光刻膠  multilevel resist


    電子束光刻膠  electron beam resist


    X射線光刻膠  X-ray resist


    刷洗  scrubbing


    甩膠  spinning


    涂膠  photoresist coating


    后烘  postbaking


    光刻  photolithography


    X射線光刻  X-ray lithography


    電子束光刻  electron beam lithography


    離子束光刻  ion beam lithography


    深紫外光刻  deep-UV lithography


    光刻機  mask aligner


    投影光刻機  projection mask aligner


    曝光  exposure


    接觸式曝光法  contact exposure method


    接近式曝光法  proximity exposure method


    光學(xué)投影曝光法  optical projection exposure method


    電子束曝光系統(tǒng)  electron beam exposure system


    分步重復(fù)系統(tǒng)  step-and-repeat system


    顯影  development


    線寬  linewidth


    去膠  stripping of photoresist


    氧化去膠  removing of photoresist by oxidation


    等離子[體]去膠  removing of photoresist by plasma


    刻蝕  etching


    干法刻蝕  dry etching


    反應(yīng)離子刻蝕  reactive ion etching,  RIE


    各向同性刻蝕  isotropic etching


    各向異性刻蝕  anisotropic etching


    反應(yīng)濺射刻蝕  reactive sputter etching


    離子銑  ion beam milling,又稱“離子磨削”。


    等離子[體]刻蝕  plasma etching


    鉆蝕  undercutting


    剝離技術(shù)  lift-off technology,又稱“浮脫工藝”。


    終點監(jiān)測  endpoint monitoring


    金屬化  metallization


    互連  interconnection


    多層金屬化  multilevel metallization


    電遷徙  electromigration


    回流  reflow


    磷硅玻璃  phosphorosilicate glass


    硼磷硅玻璃  boron-phosphorosilicate glass


    鈍化工藝  passivation technology


    多層介質(zhì)鈍化  multilayer dielectric passivation


    劃片  scribing


    電子束切片  electron beam slicing


    燒結(jié)  sintering


    印壓  indentation


    熱壓焊  thermocompression bonding


    熱超聲焊  thermosonic bonding


    冷焊  cold welding


    點焊  spot welding


    球焊  ball bonding


    楔焊  wedge bonding


    內(nèi)引線焊接  inner lead bonding


    外引線焊接  outer lead bonding


    梁式引線  beam lead


    裝架工藝  mounting technology


    附著  adhesion


    封裝  packaging


    金屬封裝  metallic packaging


    陶瓷封裝  ceramic packaging


    扁平封裝  flat packaging


    塑封  plastic package


    玻璃封裝  glass packaging


    微封裝  micropackaging,又稱“微組裝”。


    管殼  package


    管芯  die


    引線鍵合  lead bonding


    引線框式鍵合  lead frame bonding


    帶式自動鍵合  tape automated bonding, TAB


    激光鍵合  laser bonding


    超聲鍵合  ultrasonic bonding


    紅外鍵合  infrared bonding

    芯片圈(微信:xinpianquan)芯榜(微信:icrankcn)

    微電子辭典大集合

    (按首字母順序排序)


    A


    Abrupt junction 突變結(jié)

    Accelerated testing 加速實驗 

    Acceptor 受主 

    Acceptor atom 受主原子 

    Accumulation 積累、堆積 

    Accumulating contact 積累接觸 

    Accumulation region 積累區(qū) 

    Accumulation layer 積累層 

    Active region 有源區(qū) 

    Active component 有源元 

    Active device 有源器件 

    Activation 激活 

    Activation energy 激活能 

    Active region 有源(放大)區(qū) 

    Admittance 導(dǎo)納 

    Allowed band 允帶 

    Alloy-junction device

    合金結(jié)器件 Aluminum(Aluminium) 鋁 

    Aluminum – oxide 鋁氧化物 

    Aluminum passivation 鋁鈍化 

    Ambipolar 雙極的

    Ambient temperature 環(huán)境溫度 

    Amorphous 無定形的,非晶體的 

    Amplifier 功放 擴音器 放大器 

    Analogue(Analog) comparator 模擬比較器 Angstrom 埃 

    Anneal 退火 

    Anisotropic 各向異性的 

    Anode 陽極 

    Arsenic (AS) 砷 

    Auger 俄歇 

    Auger process 俄歇過程 

    Avalanche 雪崩 

    Avalanche breakdown 雪崩擊穿 

    Avalanche excitation雪崩激發(fā) 

    Icrank   芯片排行榜

    B


    Background carrier 本底載流子 

    Background doping 本底摻雜 

    Backward 反向 

    Backward bias 反向偏置 

    Ballasting resistor 整流電阻 

    Ball bond 球形鍵合 

    Band 能帶 

    Band gap 能帶間隙 

    Barrier 勢壘 

    Barrier layer 勢壘層 

    Barrier width 勢壘寬度 

    Base 基極 

    Base contact 基區(qū)接觸 

    Base stretching 基區(qū)擴展效應(yīng) 

    Base transit time 基區(qū)渡越時間 

    Base transport efficiency基區(qū)輸運系數(shù) 

    Base-width modulation基區(qū)寬度調(diào)制 

    Basis vector 基矢 

    Bias 偏置 

    Bilateral switch 雙向開關(guān) 

    Binary code 二進制代碼

    Binary compound semiconductor 二元化合物半導(dǎo)體 

    Bipolar 雙極性的 

    Bipolar Junction Transistor (BJT)雙極晶體管 

    Bloch 布洛赫 

    Blocking band 阻擋能帶 

    Blocking contact 阻擋接觸 

    Body - centered 體心立方 

    Body-centred cubic structure 體立心結(jié)構(gòu) 

    Boltzmann 波爾茲曼 

    Bond 鍵、鍵合 

    Bonding electron 價電子 

    Bonding pad 鍵合點 

    Bootstrap circuit 自舉電路 

    Bootstrapped emitter follower 自舉射極跟隨器

    Boron 硼 

    Borosilicate glass 硼硅玻璃 

    Boundary condition 邊界條件 

    Bound electron 束縛電子 

    Breadboard 模擬板、實驗板 

    Break down 擊穿 

    Break over 轉(zhuǎn)折 

    Brillouin 布里淵 

    Brillouin zone 布里淵區(qū) 

    Built-in 內(nèi)建的 

    Build-in electric field 內(nèi)建電場 

    Bulk 體/體內(nèi) Bulk absorption 體吸收 

    Bulk generation 體產(chǎn)生 

    Bulk recombination 體復(fù)合 

    Burn - in 老化 

    Burn out 燒毀 

    Buried channel 埋溝 

    Buried diffusion region 隱埋擴散區(qū) 


    C


    Can 外殼 

    Capacitance 電容 

    Capture cross section 俘獲截面 

    Capture carrier 俘獲載流子 

    Carrier 載流子、載波

    Carry bit 進位位 

    Carry-in bit 進位輸入 

    Carry-out bit 進位輸出 

    Cascade 級聯(lián) 

    Case 管殼 

    Cathode 陰極

    Center 中心 

    Ceramic 陶瓷(的) 

    Channel 溝道 

    Channel breakdown 溝道擊穿

    Channel current 溝道電流 

    Channel doping 溝道摻雜 

    Channel shortening 溝道縮短 

    Channel width 溝道寬度 

    Characteristic impedance 特征阻抗 

    Charge 電荷、充電 

    Charge-compensation effects 電荷補償效應(yīng) 

    Charge conservation 電荷守恒 

    Charge neutrality condition 電中性條件 

    Charge drive/exchange/sharing/transfer/storage 電荷驅(qū)動/交換/共享/轉(zhuǎn)移/存儲 

    Chemmical etching 化學(xué)腐蝕法 

    Chemically-Polish 化學(xué)拋光 

    Chemmically-Mechanically Polish (CMP) 化學(xué)機械拋光 Chip 芯片 

    Chip yield 芯片成品率 

    Clamped 箝位 

    Clamping diode 箝位二極管 

    Cleavage plane 解理面 

    Clock rate 時鐘頻率 

    Clock generator 時鐘發(fā)生器 

    Clock flip-flop 時鐘觸發(fā)器 

    Close-packed structure 密堆積結(jié)構(gòu) 

    Close-loop gain 閉環(huán)增益

    Collector 集電極 

    Collision 碰撞 

    Compensated OP-AMP 補償運放 

    Common-base/collector/emitter connection 共基極/集電極/發(fā)射極連接 

    Common-gate/drain/source connection 共柵/漏/源連接 

    Common-mode gain 共模增益 

    Common-mode input 共模輸入 

    Common-mode rejection ratio (CMRR) 共模抑制比 

    Compatibility 兼容性 

    Compensation 補償 

    Compensated impurities 補償雜質(zhì) 

    Compensated semiconductor 補償半導(dǎo)體 

    Complementary Darlington circuit 互補達(dá)林頓電路 

    Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS) 

    互補金屬氧化物半導(dǎo)體場效應(yīng)晶體管 

    Complementary error function 余誤差函數(shù) 

    Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 計算機輔助設(shè)計/ 測試 /制 

    造 

    Compound Semiconductor 化合物半導(dǎo)體 

    Conductance 電導(dǎo) 

    Conduction band (edge) 導(dǎo)帶(底) 

    Conduction level/state 導(dǎo)帶態(tài) 

    Conductor 導(dǎo)體

    Conductivity 電導(dǎo)率 

    Configuration 組態(tài)

    Conlomb 庫侖 

    Conpled Configuration Devices 結(jié)構(gòu)組態(tài) 

    Constants 物理常數(shù) 

    Constant energy surface 等能面 

    Constant-source diffusion恒定源擴散 

    Contact 接觸 

    Contamination 治污 

    Continuity equation 連續(xù)性方程

    Contact hole 接觸孔 

    Contact potential 接觸電勢 

    Continuity condition 連續(xù)性條件 

    Contra doping 反摻雜 

    Controlled 受控的 

    Converter 轉(zhuǎn)換器 

    Conveyer 傳輸器 

    Copper interconnection system 銅互連系統(tǒng)

    Couping 耦合 

    Covalent 共階的 

    Crossover 跨交 

    Critical 臨界的 

    Crossunder 穿交 

    Crucible坩堝 

    Crystal defect/face/orientation/lattice 晶體缺陷/晶面/晶向/晶 

    格 

    Current density 電流密度

    Curvature 曲率 

    Cut off 截止 

    Current drift/dirve/sharing 電流漂移/驅(qū)動/共享 

    Current Sense 電流取樣 

    Curvature 彎曲 

    Custom integrated circuit 定制集成電路 

    Cylindrical 柱面的 

    Czochralshicrystal 直立單晶 

    Czochralski technique 切克勞斯基技術(shù)(Cz法直拉晶體J) 

    芯片圈(微信:xinpianquan)芯榜(微信:icrankcn)

    D


    Dangling bonds 懸掛鍵 

    Dark current 暗電流 

    Dead time 空載時間 

    Debye length 德拜長度 

    De.broglie 德布洛意 

    Decderate 減速 

    Decibel (dB) 分貝 

    Decode 譯碼 

    Deep acceptor level 深受主能級 

    Deep donor level 深施主能級 

    Deep impurity level 深度雜質(zhì)能級 

    Deep trap 深陷阱 

    Defeat 缺陷 

    Degenerate semiconductor 簡并半導(dǎo)體 

    Degeneracy 簡并度 

    Degradation 退化 

    Degree Celsius(centigrade) /Kelvin 攝氏/開氏溫度 

    Delay 延遲 Density 密度 

    Density of states 態(tài)密度 

    Depletion 耗盡 

    Depletion approximation 耗盡近似 

    Depletion contact 耗盡接觸 

    Depletion depth 耗盡深度 

    Depletion effect 耗盡效應(yīng) 

    Depletion layer 耗盡層 

    Depletion MOS 耗盡MOS 

    Depletion region 耗盡區(qū) 

    Deposited film 淀積薄膜 

    Deposition process 淀積工藝 

    Design rules 設(shè)計規(guī)則 

    Die 芯片(復(fù)數(shù)dice) 

    Diode 二極管 

    Dielectric 介電的 

    Dielectric isolation 介質(zhì)隔離 

    Difference-mode input 差模輸入 

    Differential amplifier 差分放大器 

    Differential capacitance 微分電容 

    Diffused junction 擴散結(jié) 

    Diffusion 擴散 

    Diffusion coefficient 擴散系數(shù) 

    Diffusion constant 擴散常數(shù)

    Diffusivity 擴散率 

    Diffusion capacitance/barrier/current/furnace 擴散電容/勢壘/電流/爐 

    Digital circuit 數(shù)字電路 

    Dipole domain 偶極疇 

    Dipole layer 偶極層 

    Direct-coupling 直接耦合 

    Direct-gap semiconductor 直接帶隙半導(dǎo)體 

    Direct transition 直接躍遷 

    Discharge 放電 

    Discrete component 分立元件 

    Dissipation 耗散 

    Distribution 分布 

    Distributed capacitance 分布電容 

    Distributed model 分布模型 

    Displacement 位移 Dislocation 位錯 

    Domain 疇 Donor 施主 

    Donor exhaustion 施主耗盡 

    Dopant 摻雜劑 

    Doped semiconductor 摻雜半導(dǎo)體 

    Doping concentration 摻雜濃度 

    Double-diffusive MOS(DMOS)雙擴散MOS. 

    Drift 漂移 Drift field 漂移電場 

    Drift mobility 遷移率 

    Dry etching 干法腐蝕 

    Dry/wet oxidation 干/濕法氧化

    Dose 劑量 

    Duty cycle 工作周期 

    Dual-in-line package (DIP) 雙列直插式封裝 

    Dynamics 動態(tài) 

    Dynamic characteristics 動態(tài)屬性 

    Dynamic impedance 動態(tài)阻抗 


    E


    Early effect 厄利效應(yīng) 

    Early failure 早期失效 

    Effective mass 有效質(zhì)量 

    Einstein relation(ship) 愛因斯坦關(guān)系 

    Electric Erase Programmable Read Only Memory(E2PROM) 一次性電可擦除只讀存儲器 

    Electrode 電極 

    Electrominggratim 電遷移 

    Electron affinity 電子親和勢 

    Electronic -grade 電子能 

    Electron-beam photo-resist exposure 光致抗蝕劑的電子束曝光 

    Electron gas 電子氣 

    Electron-grade water 電子級純水 

    Electron trapping center 電子俘獲中心 

    Electron Volt (eV) 電子伏 

    Electrostatic 靜電的

    Element 元素/元件/配件 

    Elemental semiconductor 元素半導(dǎo)體

    Ellipse 橢圓 

    Ellipsoid 橢球 

    Emitter 發(fā)射極 

    Emitter-coupled logic 發(fā)射極耦合邏輯

    Emitter-coupled pair 發(fā)射極耦合對 

    Emitter follower 射隨器 

    Empty band 空帶 

    Emitter crowding effect 發(fā)射極集邊(擁擠)效應(yīng) 

    Endurance test =life test 壽命測試 

    Energy state 能態(tài) 

    Energy momentum diagram 能量-動量(E-K)圖 

    Enhancement mode 增強型模式 

    Enhancement MOS 增強性

    MOS Entefic (低)共溶的 

    Environmental test 環(huán)境測試 

    Epitaxial 外延的 

    Epitaxial layer 外延層 

    Epitaxial slice 外延片 

    Expitaxy 外延 

    Equivalent curcuit 等效電路 

    Equilibrium majority /minority carriers 平衡多數(shù)/少數(shù)載流子 

    Erasable Programmable ROM (EPROM)可搽?。ň幊蹋┐鎯ζ?nbsp;

    Error function complement 余誤差函數(shù) 

    Etch 刻蝕 

    Etchant 刻蝕劑 

    Etching mask 抗蝕劑掩模 

    Excess carrier 過剩載流子 

    Excitation energy 激發(fā)能 

    Excited state 激發(fā)態(tài) 

    Exciton 激子 

    Extrapolation 外推法 

    Extrinsic 非本征的 

    Extrinsic semiconductor 雜質(zhì)半導(dǎo)體 

    芯片圈(微信:xinpianquan)芯榜(微信:icrankcn)

    F


    Face - centered 面心立方 

    Fall time 下降時間 

    Fan-in 扇入 

    Fan-out 扇出 

    Fast recovery 快恢復(fù) 

    Fast surface states 快界面態(tài) 

    Feedback 反饋 

    Fermi level 費米能級 

    Fermi-Dirac Distribution 費米-狄拉克分布 

    Femi potential 費米勢 

    Fick equation 菲克方程(擴散) 

    Field effect transistor 場效應(yīng)晶體管 

    Field oxide 場氧化層 

    Filled band 滿帶 

    Film 薄膜 

    Flash memory 閃爍存儲器 

    Flat band 平帶 

    Flat pack 扁平封裝 

    Flicker noise 閃爍(變)噪聲 

    Flip-flop toggle 觸發(fā)器翻轉(zhuǎn) 

    Floating gate 浮柵 

    Fluoride etch 氟化氫刻蝕 

    Forbidden band 禁帶 

    Forward bias 正向偏置 

    Forward blocking /conducting正向阻斷/導(dǎo)通 

    Frequency deviation noise頻率漂移噪聲 

    Frequency response 頻率響應(yīng) 

    Function 函數(shù) 


    G


    Gain 增益 Gallium-Arsenide(GaAs) 砷化鉀 

    Gamy ray r 射線 

    Gate 門、柵、控制極 

    Gate oxide 柵氧化層 

    Gauss(ian) 高斯 

    Gaussian distribution profile 高斯摻雜分布

    Generation-recombination 產(chǎn)生-復(fù)合 

    Geometries 幾何尺寸 

    Germanium(Ge) 鍺 

    Graded 緩變的 

    Graded (gradual) channel 緩變溝道 

    Graded junction 緩變結(jié) 

    Grain 晶粒 

    Gradient 梯度 

    Grown junction 生長結(jié) 

    Guard ring 保護環(huán) 

    Gummel-Poom model 葛謀-潘 模型 

    Gunn - effect 狄氏效應(yīng) 

    芯片圈(微信:xinpianquan)芯榜(微信:icrankcn)

    H


    Hardened device 輻射加固器件 

    Heat of formation 形成熱 

    Heat sink 散熱器、熱沉 

    Heavy/light hole band 重/輕 空穴帶 

    Heavy saturation 重?fù)诫s 

    Hell - effect 霍爾效應(yīng) 

    Heterojunction 異質(zhì)結(jié) 

    Heterojunction structure 異質(zhì)結(jié)結(jié)構(gòu) 

    Heterojunction Bipolar Transistor(HBT)異質(zhì)結(jié)雙極型晶體 

    High field property 高場特性 

    High-performance MOS.( H-MOS)高性能

    MOS. Hormalized 歸一化 

    Horizontal epitaxial reactor 臥式外延反應(yīng)器 

    Hot carrior 熱載流子 

    Hybrid integration 混合集成 


    I


    Icrank   芯片排行榜

    Image - force 鏡象力 

    Impact ionization 碰撞電離 

    Impedance 阻抗 

    Imperfect structure 不完整結(jié)構(gòu) 

    Implantation dose 注入劑量 

    Implanted ion 注入離子 

    Impurity 雜質(zhì)

    Impurity scattering 雜志散射 

    Incremental resistance 電阻增量(微分電阻)

    In-contact mask 接觸式掩模 

    Indium tin oxide (ITO) 銦錫氧化物 

    Induced channel 感應(yīng)溝道 

    Infrared 紅外的 

    Injection 注入 

    Input offset voltage 輸入失調(diào)電壓 

    Insulator 絕緣體 

    Insulated Gate FET(IGFET)絕緣柵

    FET Integrated injection logic集成注入邏輯 

    Integration 集成、積分 

    Interconnection 互連 

    Interconnection time delay 互連延時 

    Interdigitated structure 交互式結(jié)構(gòu) 

    Interface 界面 

    Interference 干涉 

    International system of unions國際單位制 

    Internally scattering 谷間散射 

    Interpolation 內(nèi)插法 

    Intrinsic 本征的 

    Intrinsic semiconductor 本征半導(dǎo)體 

    Inverse operation 反向工作 

    Inversion 反型 

    Inverter 倒相器 

    Ion 離子

    Ion beam 離子束 

    Ion etching 離子刻蝕 

    Ion implantation 離子注入 

    Ionization 電離 

    Ionization energy 電離能 

    Irradiation 輻照 

    Isolation land 隔離島 

    Isotropic 各向同性 

    Icrank   芯片排行榜


    J


    Junction FET(JFET) 結(jié)型場效應(yīng)管 

    Junction isolation 結(jié)隔離 

    Junction spacing 結(jié)間距 

    Junction side-wall 結(jié)側(cè)壁 


    L


    Latch up 閉鎖 

    Lateral 橫向的 

    Lattice 晶格 

    Layout 版圖 

    Lattice binding/cell/constant/defect/distortion 晶格結(jié)合力/晶胞/晶格/晶格常熟 

    /晶格缺陷/晶格畸變 

    Leakage current (泄)漏電流 

    Level shifting 電平移動 

    Life time 壽命 

    linearity 線性度 

    Linked bond 共價鍵 

    Liquid Nitrogen 液氮 

    Liquid-phase epitaxial growth technique 液相外延生長技術(shù) 

    Lithography 光刻 

    Light Emitting Diode(LED) 發(fā)光二極管 

    Load line or Variable 負(fù)載線 

    Locating and Wiring 布局布線 

    Longitudinal 縱向的 

    Logic swing 邏輯擺幅 

    Lorentz 洛淪茲 

    Lumped model 集總模型 


    M


    Majority carrier 多數(shù)載流子 

    Mask 掩膜板,光刻板 

    Mask level 掩模序號 

    Mask set 掩模組 

    Mass - action law質(zhì)量守恒定律

    Master-slave D flip-flop主從D觸發(fā)器 

    Matching 匹配 

    Maxwell 麥克斯韋 

    Mean free path 平均自由程 

    Meandered emitter junction梳狀發(fā)射極結(jié) 

    Mean time before failure (MTBF) 平均工作時間 

    Megeto - resistance 磁阻 

    Mesa 臺面 

    MESFET-Metal Semiconductor金屬半導(dǎo)體FET 

    Metallization 金屬化 

    Microelectronic technique 微電子技術(shù) 

    Microelectronics 微電子學(xué) 

    Millen indices 密勒指數(shù) 

    Minority carrier 少數(shù)載流子 

    Misfit 失配 

    Mismatching 失配 

    Mobile ions 可動離子 

    Mobility 遷移率 

    Module 模塊 

    Modulate 調(diào)制 

    Molecular crystal分子晶體 

    Monolithic IC 單片IC MOSFET金屬氧化物半導(dǎo)體場效應(yīng)晶體管 

    Mos. Transistor(MOST )MOS. 晶體管 

    Multiplication 倍增 

    Modulator 調(diào)制 

    Multi-chip IC 多芯片IC 

    Multi-chip module(MCM) 多芯片模塊 

    Multiplication coefficient倍增因子 

    芯片圈(微信:xinpianquan)芯榜(微信:icrankcn)

    N


    Naked chip 未封裝的芯片(裸片) 

    Negative feedback 負(fù)反饋 

    Negative resistance 負(fù)阻 

    Nesting 套刻 

    Negative-temperature-coefficient 負(fù)溫度系數(shù) 

    Noise margin 噪聲容限 

    Nonequilibrium 非平衡 

    Nonrolatile 非揮發(fā)(易失)性 

    Normally off/on 常閉/開 

    Numerical analysis 數(shù)值分析 


    O


    Occupied band 滿帶 

    Officienay 功率 

    Offset 偏移、失調(diào) 

    On standby 待命狀態(tài) 

    Ohmic contact 歐姆接觸 

    Open circuit 開路 

    Operating point 工作點 

    Operating bias 工作偏置 

    Operational amplifier (OPAMP)運算放大器 

    Optical photon =photon 光子 

    Optical quenching光猝滅 

    Optical transition 光躍遷 

    Optical-coupled isolator光耦合隔離器 

    Organic semiconductor有機半導(dǎo)體 

    Orientation 晶向、定向 

    Outline 外形 

    Out-of-contact mask非接觸式掩模 

    Output characteristic 輸出特性 

    Output voltage swing 輸出電壓擺幅 

    Overcompensation 過補償 

    Over-current protection 過流保護 

    Over shoot 過沖 

    Over-voltage protection 過壓保護 

    Overlap 交迭 

    Overload 過載 

    Oscillator 振蕩器 

    Oxide 氧化物 

    Oxidation 氧化 

    Oxide passivation 氧化層鈍化 

    P


    Package 封裝

    Pad 壓焊點 

    Parameter 參數(shù) 

    Parasitic effect 寄生效應(yīng) 

    Parasitic oscillation 寄生振蕩 

    Passination 鈍化 

    Passive component 無源元件 

    Passive device 無源器件 

    Passive surface 鈍化界面 

    Parasitic transistor 寄生晶體管 

    Peak-point voltage 峰點電壓 

    Peak voltage 峰值電壓 

    Permanent-storage circuit 永久存儲電路 

    Period 周期 

    Periodic table 周期表 

    Permeable - base 可滲透基區(qū) 

    Phase-lock loop 鎖相環(huán)

    Phase drift 相移 

    Phonon spectra 聲子譜 

    Photo conduction 光電導(dǎo)

     Photo diode 光電二極管 

    Photoelectric cell 光電池 

    Photoelectric effect 光電效應(yīng) 

    Photoenic devices 光子器件 

    Photolithographic process 光刻工藝 

    (photo) resist (光敏)抗腐蝕劑 

    Pin 管腳 

    Pinch off 夾斷 

    Pinning of Fermi level 費米能級的釘扎(效應(yīng)) 

    Planar process 平面工藝 

    Planar transistor 平面晶體管 

    Plasma 等離子體 

    Plezoelectric effect 壓電效應(yīng) 

    Poisson equation 泊松方程 

    Point contact 點接觸 

    Polarity 極性 

    Polycrystal 多晶 

    Polymer semiconductor聚合物半導(dǎo)體 

    Poly-silicon 多晶硅 

    Potential (電)勢 

    Potential barrier 勢壘 

    Potential well 勢阱 

    Power dissipation 功耗 

    Power transistor 功率晶體管 

    Preamplifier 前置放大器 

    Primary flat 主平面 

    Principal axes 主軸 

    Print-circuit board(PCB) 印制電路板 

    Probability 幾率 

    Probe 探針 

    Process 工藝 

    Propagation delay 傳輸延時 

    Pseudopotential method 膺勢發(fā) 

    Punch through 穿通 

    Pulse triggering/modulating 脈沖觸發(fā)/調(diào)制Pulse 

    Widen Modulator(PWM) 脈沖寬度調(diào)制 

    Punchthrough 穿通 

    Push-pull stage 推挽級 

    芯片圈(微信:xinpianquan)芯榜(微信:icrankcn)

    Q


    Quality factor 品質(zhì)因子 

    Quantization 量子化 

    Quantum 量子 

    Quantum efficiency量子效應(yīng) 

    Quantum mechanics 量子力學(xué) 

    Quasi – Fermi-level準(zhǔn)費米能級 

    Quartz 石英 


    R


    Radiation conductivity 輻射電導(dǎo)率 

    Radiation damage 輻射損傷 

    Radiation flux density 輻射通量密度 

    Radiation hardening 輻射加固 

    Radiation protection 輻射保護 

    Radiative - recombination輻照復(fù)合 

    Radioactive 放射性 

    Reach through 穿通 

    Reactive sputtering source 反應(yīng)濺射源 

    Read diode 里德二極管 

    Recombination 復(fù)合 

    Recovery diode 恢復(fù)二極管 

    Reciprocal lattice 倒核子 

    Recovery time 恢復(fù)時間 

    Rectifier 整流器(管) 

    Rectifying contact 整流接觸 

    Reference 基準(zhǔn)點 基準(zhǔn) 參考點 

    Refractive index 折射率 

    Register 寄存器 

    Registration 對準(zhǔn) 

    Regulate 控制 調(diào)整 

    Relaxation lifetime 馳豫時間 

    Reliability 可靠性 

    Resonance 諧振 

    Resistance 電阻 

    Resistor 電阻器 

    Resistivity 電阻率 

    Regulator 穩(wěn)壓管(器) 

    Relaxation 馳豫 

    Resonant frequency共射頻率 

    Response time 響應(yīng)時間 

    Reverse 反向的 

    Reverse bias 反向偏置 


    S


    Sampling circuit 取樣電路 

    Sapphire 藍(lán)寶石(Al2O3) 

    Satellite valley 衛(wèi)星谷 

    Saturated current range電流飽和區(qū) 

    Saturation region 飽和區(qū)

    Saturation 飽和的 

    Scaled down 按比例縮小 

    Scattering 散射 

    Schockley diode 肖克萊二極管 

    Schottky 肖特基 

    Schottky barrier 肖特基勢壘 

    Schottky contact 肖特基接觸 

    Schrodingen 薛定厄 

    Scribing grid 劃片格 

    Secondary flat 次平面 

    Seed crystal 籽晶 

    Segregation 分凝 

    Selectivity 選擇性 

    Self aligned 自對準(zhǔn)的 

    Self diffusion 自擴散 

    Semiconductor 半導(dǎo)體 

    Semiconductor-controlled rectifier 可控硅 

    Sendsitivity 靈敏度 

    Serial 串行/串聯(lián) 

    Series inductance 串聯(lián)電感 

    Settle time 建立時間 

    Sheet resistance 薄層電阻 

    Shield 屏蔽

    Short circuit 短路 

    Shot noise 散粒噪聲

    Shunt 分流 

    Sidewall capacitance 

    邊墻電容 Signal 信號 

    Silica glass 石英玻璃 

    Silicon 硅 

    Silicon carbide 碳化硅 

    Silicon dioxide (SiO2) 二氧化硅 

    Silicon Nitride(Si3N4) 氮化硅 

    Silicon On Insulator 絕緣硅 

    Siliver whiskers 銀須 

    Simple cubic 簡立方 

    Single crystal 單晶 

    Sink 沉 

    Skin effect 趨膚效應(yīng) 

    Snap time 急變時間 

    Sneak path 潛行通路 

    Sulethreshold 亞閾的 

    Solar battery/cell 太陽能電池 

    Solid circuit 固體電路 

    Solid Solubility 固溶度 

    Sonband 子帶 

    Source 源極 

    Source follower 源隨器 

    Space charge 空間電荷 

    Specific heat(PT) 熱 

    Speed-power product 速度功耗乘積 Spherical 球面的 

    Spin 自旋 Split 分裂 

    Spontaneous emission 自發(fā)發(fā)射 

    Spreading resistance擴展電阻 

    Sputter 濺射 Stacking fault 層錯 

    Static characteristic 靜態(tài)特性 

    Stimulated emission 受激發(fā)射 

    Stimulated recombination 受激復(fù)合 

    Storage time 存儲時間 

    Stress 應(yīng)力 

    Straggle 偏差 

    Sublimation 升華 

    Substrate 襯底 

    Substitutional 替位式的 

    Superlattice 超晶格 

    Supply 電源 Surface 表面 

    Surge capacity 浪涌能力 

    Subscript 下標(biāo) 

    Switching time 開關(guān)時間 

    Switch 開關(guān) 


    T


    Tailing 擴展 

    Terminal 終端 

    Tensor 張量 Tensorial 張量的 

    Thermal activation 熱激發(fā) 

    Thermal conductivity 熱導(dǎo)率 

    Thermal equilibrium 熱平衡 

    Thermal Oxidation 熱氧化 

    Thermal resistance 熱阻 

    Thermal sink 熱沉 

    Thermal velocity 熱運動 

    Thermoelectricpovoer 溫差電動勢率 

    Thick-film technique 厚膜技術(shù) 

    Thin-film hybrid IC薄膜混合集成電路 

    Thin-Film Transistor(TFT) 薄膜晶體 

    Threshlod 閾值 

    Thyistor 晶閘管 

    Transconductance 跨導(dǎo) 

    Transfer characteristic 轉(zhuǎn)移特性 

    Transfer electron 轉(zhuǎn)移電子 

    Transfer function 傳輸函數(shù) Transient 瞬態(tài)的 

    Transistor aging(stress) 晶體管老化 

    Transit time 渡越時間 

    Transition 躍遷 

    Transition-metal silica 過度金屬硅化物 

    Transition probability 躍遷幾率 

    Transition region 過渡區(qū) 

    Transport 輸運 Transverse 橫向的 

    Trap 陷阱 Trapping 俘獲 

    Trapped charge 陷阱電荷 

    Triangle generator 三角波發(fā)生器 

    Triboelectricity 摩擦電

     Trigger 觸發(fā) 

    Trim 調(diào)配 調(diào)整 

    Triple diffusion 三重擴散 

    Truth table 真值表 

    Tolerahce 容差 

    Tunnel(ing) 隧道(穿) 

    Tunnel current 隧道電流 

    Turn over 轉(zhuǎn)折 

    Turn - off time 關(guān)斷時間 


    U


    Ultraviolet 紫外的 

    Unijunction 單結(jié)的 

    Unipolar 單極的 

    Unit cell 原(元)胞 

    Unity-gain frequency 單位增益頻率 

    Unilateral-switch單向開關(guān) 


    V


    Vacancy 空位 Vacuum 真空 

    Valence(value) band 價帶 Value band edge 價帶頂 

    Valence bond 價鍵 Vapour phase 汽相 

    Varactor 變?nèi)莨?Varistor 變阻器 

    Vibration 振動 Voltage 電壓 


    W


    Wafer 晶片 

    Wave equation 波動方程 

    Wave guide 波導(dǎo) 

    Wave number 波數(shù) 

    Wave-particle duality 波粒二相性 

    Wear-out 燒毀 

    Wire routing 布線 

    Work function 功函數(shù) 

    Worst-case device 最壞情況器件 


    Y


    Yield 成品率  


    Z


    Zener breakdown 齊納擊穿 

    Zone melting 區(qū)熔法 

Copyright? 浙江世菱半導(dǎo)體有限公司 All Rights Reserved     浙ICP備18042601號-1